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<p><i>A special issue of</i><i><span> </span></i><i><a
href="https://www.mdpi.com/journal/sensors" style="box-sizing:
border-box; line-height: inherit; text-decoration: none;
max-height: 1000000px; font-weight: 700;"><span
style="box-sizing: border-box; font-style: italic;
line-height: inherit; max-height: 1e+06px;">Sensors</span></a></i><i><span> </span></i><i>(ISSN
1424-8220). <br>
</i></p>
<p><i>This special issue belongs to the section "</i><i><a
href="https://www.mdpi.com/journal/sensors/sections/Intelligent_Sensors"
style="box-sizing: border-box; line-height: inherit;
text-decoration: none; max-height: 1000000px; font-weight:
700;">Intelligent Sensors</a></i><i>". </i></p>
<p style="box-sizing: border-box; margin: 0px 0px 10px; padding:
0.5em 0px; font-family: Arial; font-size: 13px; font-weight: 400;
line-height: 1.6; text-rendering: optimizelegibility; max-height:
1000000px; font-variant-ligatures: normal; font-variant-caps:
normal; letter-spacing: normal; text-align: start; text-indent:
0px; text-transform: none; white-space: normal; word-spacing: 0px;
-webkit-text-stroke-width: 0px; background-color: rgb(255, 255,
255); text-decoration-thickness: initial; text-decoration-style:
initial; text-decoration-color: initial;"><i><span
class="si-deadline" style="box-sizing: border-box; max-height:
1e+06px;">Deadline for manuscript submissions:<span> </span><b
style="box-sizing: border-box; font-weight: 700;
line-height: inherit; max-height: 1e+06px;">30 June 2021</b></span></i><i>.</i></p>
<p style="box-sizing: border-box; margin: 0px 0px 10px; padding:
0.5em 0px; font-family: Arial; font-size: 13px; font-weight: 400;
line-height: 1.6; text-rendering: optimizelegibility; max-height:
1000000px; color: rgb(34, 34, 34); font-variant-ligatures: normal;
font-variant-caps: normal; letter-spacing: normal; text-align:
start; text-indent: 0px; text-transform: none; white-space:
normal; word-spacing: 0px; -webkit-text-stroke-width: 0px;
background-color: rgb(255, 255, 255); text-decoration-thickness:
initial; text-decoration-style: initial; text-decoration-color:
initial;"><i>***************************************<br>
</i></p>
<b>INFO</b>
<div class="moz-forward-container">Dear Colleagues, <br>
This Special Issue will focus on recent advances of specific
technologies and applications for 3D imaging. 3D sensing and
related applications is a rapidly growing research field where
novel solutions are catching significant interest both from
academic and industrial people. According to Allied Market
Research, the global 3D camera market is projected to reach $11.13
billion by 2024, registering a Compound Annual Growth Rate of
37.1% during the period of 2018 to 2024.<br>
<br>
Nowadays, a large number of medium to high level smartphones
started integrating 3D sensors for applications ranging from 3D
face recognition to avatar creation and photography enhancement,
but 3D sensing is also becoming crucial for self-driving cars
where LiDARs represent the main device for pedestrian and vehicle
detection estimating their distance. Another field where 3D
sensors are playing a crucial role is industry 4.0 and
manufacturing, where their combination with AI has become a
fundamental element for quality control in production lines,
driverless transport systems, or random bin picking.<br>
<br>
Assistive technologies also greatly benefit from 3D sensing, as
does the analysis of sports contexts and the monitoring of natural
and manufactured structures for disaster prevention and resilience
tasks.<br>
<br>
The aforementioned applicative fields are a few examples of
contexts where 3D sensing is capturing a growing relevance and in
this Special Issue innovative sensors, dedicated hardware and
related applications (e.g., stereoscopic imaging, structured
light, SPAD cameras or Time-of-Flight Sensing) are welcomed.<br>
<br>
Dr. Marco Leo<br>
Prof. Dr. Marco Marcon<br>
Guest Editors<br>
<p><br>
</p>
<p><b>WEBSITE </b><a moz-do-not-send="true"
href="https://www.mdpi.com/journal/sensors/special_issues/3D_Cameras">https://www.mdpi.com/journal/sensors/special_issues/3D_Cameras</a><br>
</p>
<b>Manuscript Submission Information</b><br>
<br>
Manuscripts should be submitted online at <a
class="moz-txt-link-abbreviated" href="http://www.mdpi.com"
moz-do-not-send="true">www.mdpi.com</a> by registering and
logging in to this website. Once you are registered, click here to
go to the submission form. Manuscripts can be submitted until the
deadline. All papers will be peer-reviewed. Accepted papers will
be published continuously in the journal (as soon as accepted) and
will be listed together on the special issue website. Research
articles, review articles as well as short communications are
invited. For planned papers, a title and short abstract (about 100
words) can be sent to the Editorial Office for announcement on
this website.<br>
<br>
Submitted manuscripts should not have been published previously,
nor be under consideration for publication elsewhere (except
conference proceedings papers). All manuscripts are thoroughly
refereed through a single-blind peer-review process. A guide for
authors and other relevant information for submission of
manuscripts is available on the Instructions for Authors page.
Sensors is an international peer-reviewed open access semimonthly
journal published by MDPI.<br>
<br>
Please visit the Instructions for Authors page before submitting a
manuscript. The Article Processing Charge (APC) for publication in
this open access journal is 2200 CHF (Swiss Francs). Submitted
papers should be well formatted and use good English. Authors may
use MDPI's English editing service prior to publication or during
author revisions.<br>
<br>
<p><b>Keywords</b></p>
3D sensors<br>
<p>Stereo Vision</p>
<p>Structured Light cameras</p>
Time of Flight cameras<br>
<p>Depth maps acquisition</p>
<p>LiDAR</p>
<p><br>
</p>
<p><b>Special Issue Editors</b><br>
<br>
Dr. Marco Leo<br>
E-Mail Website SciProfiles<br>
Guest Editor<br>
R&D Computer Vision and Pattern Recognition, DHITECH -
University Campus of Lecce, Via Monteroni, 73100 Lecce, Italy<br>
Interests: Computer Vision; Machine Learning; Signal Processing;
Assistive technology<br>
Special Issues and Collections in MDPI journals<br>
<br>
Prof. Dr. Marco Marcon<br>
E-Mail Website<br>
Guest Editor<br>
Politecnico di Milano, Milan, Italy<br>
Interests: Computer Vision; 3D acquisition systems; Tomography<br>
Special Issue Information</p>
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