[visionlist] [CFP] SPIE Multimodal Sensing and Artificial Intelligence: Technologies and Applications

Cosimo Distante cosimo.distante at cnr.it
Mon Nov 12 03:48:23 -05 2018


Internationales Congress Center
Munich, Germany 24 - 27 June 2019

https://spie.org/EOM/conferencedetails/multimodal-sensing-and-artificial-intelligence <https://spie.org/EOM/conferencedetails/multimodal-sensing-and-artificial-intelligence>

The conference goal is to provide a unique forum for discussing how Artificial Intelligence could provide benefits to multi-modal image analysis and processing. Multi-modal imaging refers to systems able to acquire multiple 2D or 3D information about real scenes, with different sensing modality (ex: 3D point clouds, visible and infrared images, thermal images, hyperspectral sensing, and so on) and is used on a broad range of sensing-based applications. Artificial Intelligence, on the other hand, found recently a new renaissance, thanks to Machine Learning and Deep Learning paradigms successfully applied for addressing very challenging image interpretation tasks. In this context, researchers, developers and practitioners are encouraged to present the latest advance, highlighting how multi-modal sensing technologies and applications can benefit from using Artificial Intelligence based methodologies. The conference, with a specific emphasis on exploiting Artificial Intelligence methodologies, is focused on both: a) the metric performance of sensors and algorithms for producing the most accurate and reliable geometric measurements and models; and b) applications in different fields. 

The conference targets topics related to multimodal imaging systems (calibration, performance, accuracy, etc.) and their application in various tasks such as object recognition, motion estimation, 3D reconstruction, autonomous mobile robot navigation, quality control, assembly in manufacturing, security, environment monitoring, medical imaging, holography, biomedical imaging. 

Themes such as industrial inspection, material and component testing, virtual museums, motion analysis, mobile robot navigation, marketing and tourism, human body modeling, maritime sciences, medicine, aerospace, automotive, agrifood, security and the exploration of remote and hazardous sites, just to name a few, provide the contexts in which multi-modal sensing and AI methodologies can be synergically applied. 
We invite submission of original research contributions, as well as demonstrations of successful applications in, but not limited to, the following technical areas 

Multimodal Sensing: Technology
3D passive sensors 
3D active sensors 
hyperspectral imaging 
light-field 3D sensing 
full-field methods for inspection (holography, shearography, DIC) 
thermography 
interferometry . 

Multimodal Sensing: Processing
calibration and measurements 
pose estimation 
image and range based modelling 
3D passive reconstruction 
3D active reconstruction 
motion analysis 
multiview analysis 
real-time processing technology 
expert system for detection and diagnosis of defects 
embedded vision systems. 

Multimodal Sensing: Applications
object recognition 
scene interpretation 
autonomous robot navigation 
robotics 
surveillance 
environmental monitoring 
surface quality control 
industrial Inspection 
face analysis 
nondestructive testing methods 
noninvasive inspection techniques 
automation for material testing 
development compact systems for in-situ inspection 
monitoring of civil infrastructures (bridges, highways, buildings, Railways) 
sensors for homeland-security 
innovative systems for imaging and display systems 
intelligent farm 
intelligent factory 
intelligent building 
intelligent systems in health and medicine 
bio-informatics.

Important Dates
Abstract Due:
9 January 2019

Author Notification:
26 February 2019

Manuscript Due Date:
17 April 2019


Conference Chair
Ettore Stella, CNR (Italy) 

Conference Co-Chairs
Shahriar Negahdaripour, Univ. of Miami (United States) 
Dariusz Ceglarek, The Univ. of Warwick (UK) 
Christian Möller, Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung (Germany) 

Program Committee
Andrei Asiminov <https://spie.org/profile/Andrey.Anisimov-104315>, Technische Univ. Delft (Netherlands) 
Salah Bourennane <https://spie.org/profile/Salah.Bourennane-60842>, Institut Fresnel (France) 
Cosimo Distante <http://people.isasi.cnr.it/~c.distante/>, CNR/Univ. del Salento (Italy) 
Pietro Ferraro <https://spie.org/profile/Pietro.Ferraro-9436>, Istituto di Scienze Applicate e Sistemi Intelligenti "Eduardo Caianiello" (Italy) 
Marc P. Georges <https://spie.org/profile/Marc.Georges-17633>, Liège Univ. (Belgium) 
Antonio Lanzotti, Univ. degli Studi di Napoli Federico II (Italy) 
Luiz Marcos Garcia Gonçalves, UFRN (Brazil) 
Michele Meo <https://spie.org/profile/Michele.Meo-29109>, Univ. of Bath (United Kingdom) 
Thomas B. Moeslund, Aalborg Univ. (Denmark) 
Nicola Mosca, CNR (Italy) 
Vito Pagliarulo, Istituto di Scienze Applicate e Sistemi Intelligenti "Eduardo Caianiello" (Italy) 
Clive Roberts, The Univ. of Birmingham (United Kingdom) 
Pierre R. Slangen <https://spie.org/profile/Pierre.Slangen-15886>, Mines Alès (France) 
Rocco Zito, Flinders Univ. (Australia) 

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